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specification part no. : MT6224-AHRG-A 5.0mm round bi-color lamp (2 leads) observe precaution for handling electro static sensitive devices attention 3northway lane north latham,new york 12110. tollfree:1.800.984.5337 phone:1.518.956.2980 fax:1.518.785.4725 http://www.marktechopto.com
rev.: 01 d ate: 2005/10/15 p age: 1 /5 description this g/r lamp is made with algaas/gaas red chip and gap/gap green chip and white diffused epoxy resin. ? common anode orange cathode green cathode notes: 1. all dimensions are in mm. 2. tolerance is 0.25mm unless otherwise noted. description led chip part no. material emitting color description gap/gap green 07$+5*$ algaas/gaas red white diffused MT6224-AHRG-A 5.0mm round bi- color lamp(3leads)
rev.: 01 d ate: 2005/10/15 p age: 2 /5 absolute maximum ratings at ta=25
parameter symbol rating unit power dissipation p d 78 mw reverse voltage v r 5 v d.c. forward current if 30 ma reverse (leakage) current ir 100 ?a peak current(1/10duty cycle,0.1m s pulse width.) if(peak) 100 ma operating temperature range topr. -25 to +85
storage temperature range tstg. -40 to +100
lead soldering temp.(1.6mm from body) for 5 seconds 260
electrical and optical characteristics: green parameter symbol condition min. typ. max. unit luminous intensity i v if=10ma 30.0 50.0 mcd forward voltage vf if=10ma 2.1 2.6 v peak wavelength p if=10ma 568 nm dominant wavelength d if=10ma 570 nm reverse (leakage) current ir vr=5v 100 a viewing angle 21/2 if=10ma 70 deg spectrum line halfwidth ? if=10ma 30 nm note: the datas tested by is tester MT6224-AHRG-A 5.0mm round bi- color lamp(3leads)
rev.: 01 d ate: 2005/10/15 p age: 3 /5 absolute maximum ratings at ta=25
parameter symbol rating unit power dissipation p d 66 mw reverse voltage v r 5 v d.c. forward current if 30 ma reverse (leakage) current ir 100 ?a peak current(1/10duty cycle,0.1m s pulse width.) if(peak) 100 ma operating temperature range topr. -25 to +85
storage temperature range tstg. -40 to +100
lead soldering temp.(1.6mm from body) for 5 seconds 260
electrical and optical characteristics: red parameter symbol condition min. typ. max. unit luminous intensity i v if=10ma 36.0 60.0 mcd forward voltage vf if=10ma 1.8 2.2 v peak wavelength p if=10ma 630 nm dominant wavelength d if=10ma 622 nm reverse (leakage) current ir vr=5v 100 a viewing angle 21/2 if=10ma 70 deg spectrum line halfwidth ? if=10ma 20 nm note: the datas tested by is tester MT6224-AHRG-A 5.0mm round bi- color lamp(3leads)
rev.: 01 d ate: 2005/10/15 p age: 4 /5 typical electrical / optical characteristics curves : applied voltage (v) forward current vs.applied voltage forward current if(ma) 10 20 40 30 50 1.2 1.6 2.0 2.4 2.8 3.2 g r 20.0 forward current (ma) forward current vs. luminous intensity relative luminous intensity 10.0 0 20 40 80 60 100 30.0 0.0 g r temperature( f c) 0 20 40 60 10080 forward current if(ma) 10 20 40 30 50 radiation diagram 0.7 0.5 0.3 0.8 0.9 1.0 0.2 0.1 0.4 0.6 90 60 80 70 50 40 30 20 0 10 MT6224-AHRG-A 5.0mm round bi- color lamp(3leads)
MT6224-AHRG-A 5.0mm round bi- color lamp(3leads) rev.: 01 d ate: 2005/10/15 p age: 5 /5 precautions: take note of the following in use of led 1. temperature in use since the light generated inside the led needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. consequently, the heat resistant ability of the resin used for led is usually low; therefore, please be careful on the following during use. avoid applying external force, stress, and excessi ve vibration to the resins and terminals at high temperature. the glass transition temperature of epoxy resin used for the led is approximately 120-130
. at a temperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. if external force or stress is applied at that time, it may cause a wire rupture. 2. soldering please be careful on the following at soldering. after soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temp erature), (1) soldering measurements: distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) solder dip: preheat: 90
max. (backside of pcb), within 120 seconds solder bath: 250
max. (solder temperature), within 5 seconds (3) soldering iron : 250
max. (temperature of soldering iron tip), within 3 seconds 3. insertion pitch of the led leads and pitch of mounting holes need to be same 4. others since the heat resistant ability of the led resin is low, smd components are used on the same pcb, please mount the led after adhesive baking process for smd components. in case adhesive baking is done after led lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the led and follow the conditions below. baking temperature: 120
max. baking time: within 60 seconds if soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the led to normal temperature.

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